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UPC – Master in Semiconductor Engineering and Microelectronic Design

If you want to understand how chips are designed or how semiconductor devices are made, this programme offers two connected routes into the subject.

Study with Universitat Politècnica de Catalunya.

Course essentials

Institution
Universitat Politècnica de Catalunya (UPC)
Country
Spain
Subject
Engineering
Study level
Master's degree
Teaching language
English
Study format
On campus
Campus
ETSETB Barcelona, Spain; interuniversity programme with UB, UAB and URV
Duration
1 academic year
Credits
60 ECTS
Tuition
The official page lists approximately €1,162 for the programme, or €2,700 for non-EU residents, excluding non-teaching fees and the degree certificate. It does not label the fee's academic year; confirm your category and current quote with UPC.
Intake
September; the official page currently says pre-enrolment is closed.

Official information

Information reviewed: 2026-10-27

Learning and experience

English-taught specialisations cover semiconductor engineering and microelectronic design. The curriculum includes device or circuit study, industry and research seminars, and a 10-credit thesis. Four universities participate with collaboration from IMB-CNM.

Who it may suit

The course can help you explore circuit design, semiconductor technologies or further research. Choosing between device manufacturing and circuit design is an important part of making the degree fit your interests.

Applying and costs

Use UPC’s master’s admission requirements and the programme team to assess your previous technical studies. Check the specialisation’s preparation requirements before selecting your route.

The official page lists approximately €1,162 for the programme, or €2,700 for non-EU residents, excluding non-teaching fees and the degree certificate. It does not label the fee’s academic year; confirm your category and current quote with UPC.

Our Spain study guide covers the wider move and living-cost planning.

Sources: official programme page. Reviewed 27 October 2026.