If you want to understand how chips are designed or how semiconductor devices are made, this programme offers two connected routes into the subject.
Study with Università Politecnica di Catalunya.
Elementi essenziali del corso
- Istituzione
- Università Politecnica di Catalogna (UPC)
- Paese
- Spagna
- Oggetto
- Ingegneria
- Livello di studio
- Laurea magistrale
- L'insegnamento della lingua
- Inglese
- Formato di studio
- All'interno del campus
- Campus
- ETSETB Barcelona, Spain; interuniversity programme with UB, UAB and URV
- Durata
- 1 anno accademico
- Crediti
- 60 ECTS
- Lezioni
- The official page lists approximately €1,162 for the programme, or €2,700 for non-EU residents, excluding non-teaching fees and the degree certificate. It does not label the fee's academic year; confirm your category and current quote with UPC.
- Ingresso
- September; the official page currently says pre-enrolment is closed.
Information reviewed: 2026-10-27
Apprendimento e esperienza
English-taught specialisations cover semiconductor engineering and microelectronic design. The curriculum includes device or circuit study, industry and research seminars, and a 10-credit thesis. Four universities participate with collaboration from IMB-CNM.
Who it may suit
The course can help you explore circuit design, semiconductor technologies or further research. Choosing between device manufacturing and circuit design is an important part of making the degree fit your interests.
Applying and costs
Use UPC’s master’s admission requirements and the programme team to assess your previous technical studies. Check the specialisation’s preparation requirements before selecting your route.
The official page lists approximately €1,162 for the programme, or €2,700 for non-EU residents, excluding non-teaching fees and the degree certificate. It does not label the fee’s academic year; confirm your category and current quote with UPC.
Il nostro Guida allo studio per la Spagna covers the wider move and living-cost planning.
Sources: official programme page. Reviewed 27 October 2026.